Curing
Controlled thermal processes for semiconductor and industrial materials.
— PI curing— BCB curing— BPO curing
Related families: AOL Series · Semiconductor process ovens
Solutions
Begin with the process—not the machine.
01
Each solution pathway is based on applications or product families present on the official DONE-E website. Engineering review is required for final selection.
Find your systemDrying & Baking
Batch and continuous drying for wafers, electronics, and industrial components.
— Wafer baking— Clean drying— Industrial drying
Related families: COL Series · MHG Series · LC Series · DS Series
Annealing & Heat Treatment
Thermal systems for annealing, aging, and industrial heat-treatment workflows.
— Wafer annealing— Aging— Heat treatment
Related families: Semiconductor annealing systems · MAH Series · MHO Series
Controlled Atmosphere
Thermal processing under clean, nitrogen, low-oxygen, or vacuum conditions.
— Low-oxygen processing— Nitrogen processing— Vacuum processing— Clean processing
Related families: AOL Series · QMO Series · PHH Series · VD Series
Reliability Testing
Temperature, humidity, powered-aging, and thermal-shock test workflows.
— Powered aging— Temperature testing— Temperature and humidity testing— Thermal shock
Related families: MHG powered-test systems · HTT Series · TTX Series
Automated Production
Programmed batch, multi-chamber, PEB, and inline thermal production.
— Batch automation— Inline thermal processing— Automated material handling
Related families: DS Series · QMO Series · Automated custom systems
Engineering review