Semiconductor Process Ovens
QMO-6D
Six-Chamber Clean Low-Oxygen Oven
A six-chamber clean, low-oxygen system with programmable control, PC monitoring, and documented MES connectivity.
Semiconductor Process Ovens
AOL-2D-PC
Dual-Chamber Clean Low-Oxygen Oven
A two-chamber, independently controlled thermal system for clean, low-oxygen curing, baking, drying, and aging processes.
Official DONE-E equipment image
450°C
Maximum temperature
2
Independent chambers
≤10 ppm + gas O₂
High-temp oxygen
5 s
Minimum record interval
Product overview
Two clean process chambers. One integrated control platform.
AOL-2D-PC is a vertically stacked, independently controlled dual-chamber system for clean and low-oxygen thermal processing. DONE-E documents its use for BPO, PI, and BCB curing, wafer and IC-related work, precision electronics, electronic ceramics, drying, and aging.
01
Independent chambers
Each chamber is controlled independently, supporting separated process operation.
02
Controlled atmosphere
Supply/exhaust control and documented oxygen monitoring support clean low-oxygen work.
03
Data traceability
Temperature, oxygen, batch, alarm, event, and operation records are documented.
04
Factory connection
The product page states TCP/IP connection to a factory system for process management.
Applications
Documented process applications.
Applications are taken from the official AOL-2D-PC page and are not transferred from other models.
01
BPO, PI, and BCB curing
02
Wafer and IC-related thermal processing
03
Clean and low-oxygen drying
04
Precision electronics and electronic ceramics
05
Thermal aging
Technical specifications
Verified performance and construction data.
Fields absent from the official page—including chamber dimensions, external dimensions, power, and weight—are intentionally omitted.
| Chamber arrangement | 2 chambers, stacked |
|---|---|
| Control | Independent control for each chamber |
| Operating temperature | RT to 400°C |
| Maximum temperature | 450°C |
| Temperature stability | ±1°C |
| Temperature uniformity | ±10°C at 400°C plateau |
| High-temperature oxygen concentration | ≤10 ppm + supply-gas O₂ content |
| Low-temperature oxygen concentration | ≤20 ppm + supply-gas O₂ content |
| Interior | SUS304 mirror-finish stainless steel |
| Heater | Stainless steel |
| Empty-chamber heat-up time | 1.5 hCondition stated on the official product page. |
| Empty-chamber cool-down | 375°C to 80°C in 1.5–3.5 hWater and air cooling. |
| Data record interval | Minimum 5 s |
The official DONE-E source URL is retained in the internal product data for factual audit.
Control & automation
Process records built into the system architecture.
The official product page states an Omron PLC and industrial PC architecture, but no approved English HMI screenshot is currently available for this prototype.
Media placeholder
Official AOL control-system screenshot to be supplied.
- 01Omron PLC and industrial PC control architecture
- 02Multi-step process programming with event outputs
- 03Temperature and oxygen-concentration recording
- 04Six-point temperature monitoring
- 05Batch, data, alarm, event, and operation traceability
- 06PC records readable with spreadsheet software
- 07TCP/IP connection to a factory system for process management
Typical process example
A documented staged curing profile.
This is the example shown on the official AOL-2D-PC page. It is not a fixed recipe for every material or process.
01
200°C
Ramp · 40 min
3–5°C/min
02
200°C
Soak · 45 min
Plateau
03
375°C
Ramp · 40 min
To upper soak
04
375°C
Soak · 60 min
Plateau
05
75°C
Cool · 79 min
3–5°C/min
View original official process graphic
Options & configuration
Configure only from documented capabilities.
The prototype asks for process, temperature, oxygen, cooling, data, and factory-connection requirements. Any final option remains subject to engineering confirmation.
Configure this systemProcess program
Multi-step programs and event outputs are documented.
Atmosphere requirement
High- and low-temperature oxygen performance is stated with a supply-gas caveat.
Cooling
Water and air cooling are documented for the stated empty-chamber cool-down.
Factory connection
TCP/IP factory-system connection is documented; MES is not claimed for this model.
Downloads
Technical documents.
No English PDF has been supplied or verified for this model. The interface remains visible without fabricating files.
Coming soon
Datasheet
Approved English document required.
Coming soon
Operation manual
Approved English document required.
Coming soon
Application guide
Approved English document required.
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