
AO-2DSL-FCNET
Low-Oxygen Oven
- Chamber dimensions
- W1000 × D500 × H610 × 2 mm
- Temperature range
- RT (Ambient) +60 to +300°C
Semiconductor Process Ovens
Six-Chamber Clean Low-Oxygen Oven
A six-chamber clean, low-oxygen system with programmable control, PC monitoring, and documented MES connectivity.

Key performance
Values are shown only when they were extractable from this model's official DONE-E page.
Product overview
A six-chamber clean, low-oxygen system with programmable control, PC monitoring, and documented MES connectivity.
Data status
Manually reviewed against the official DONE-E product page
Source verification
Official DONE-E source URLs are retained in the internal product data for factual audit.
Applications
Technical specifications
No value is borrowed from another product. Fields missing from the official page remain unpublished here.
| Chambers | 6 |
|---|---|
| Chamber size | W500 × H500 × D500 mm × 6 |
| Temperature range | RT +20°C to 300°C |
| Cleanliness | Class 100 |
| Oxygen concentration | ≤20 ppm |
| Empty uniformity | ±1.5% |
| Loaded uniformity | ±2% |
Translation and unit presentation are provided for navigation. The cited official source remains the audit reference.
Features, control & automation
Downloads
English datasheet
Coming soon — no PDF fabricated
Application guide
Coming soon — no PDF fabricated
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Engineering review