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Semiconductor Process Ovens

QMO-6D

Six-Chamber Clean Low-Oxygen Oven

A six-chamber clean, low-oxygen system with programmable control, PC monitoring, and documented MES connectivity.

QMO-6D — official DONE-E product image

Key performance

Published values at a glance.

Chambers
6
Chamber size
W500 × H500 × D500 mm × 6
Temperature range
RT +20°C to 300°C
Cleanliness
Class 100

Product overview

Source-led, model-specific information.

A six-chamber clean, low-oxygen system with programmable control, PC monitoring, and documented MES connectivity.

Data status

Manually reviewed against the official DONE-E product page

Source verification

Official DONE-E source URLs are retained in the internal product data for factual audit.

Applications

  • Clean low-oxygen thermal processing
  • Multi-batch semiconductor production
  • Programmable heating and controlled cooling

Technical specifications

Published model data.

No value is borrowed from another product. Fields missing from the official page remain unpublished here.

Chambers6
Chamber sizeW500 × H500 × D500 mm × 6
Temperature rangeRT +20°C to 300°C
CleanlinessClass 100
Oxygen concentration≤20 ppm
Empty uniformity±1.5%
Loaded uniformity±2%

Translation and unit presentation are provided for navigation. The cited official source remains the audit reference.

Features, control & automation

Only capabilities detected on this product page.

  • Omron PLC and PC interface
  • Multi-step programmable control
  • Multi-equipment monitoring from the PC
  • Historical data, operation, and alarm queries
  • MES connectivity
  • Door, heater, and damper interlocks

Downloads

Technical documents.

English datasheet

Coming soon — no PDF fabricated

Application guide

Coming soon — no PDF fabricated

Engineering review

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