
AOL-100-PC
PI / BPO / BCB Curing Oven
- Temperature range
- Ambient+20°C to 500°C
- Cleanliness
- Class 100
Semiconductor Process Ovens
Low-Oxygen Oven
Low-Oxygen Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.

Key performance
Values are shown only when they were extractable from this model's official DONE-E page.
Product overview
Low-Oxygen Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.
Data status
Verified specifications translated from the official product page
Source verification
Official DONE-E source URLs are retained in the internal product data for factual audit.
2 official records were consolidated into this one English model page.
Applications
Technical specifications
No value is borrowed from another product. Fields missing from the official page remain unpublished here.
| Chamber dimensions | W1000 × D500 × H610 × 2 mm |
|---|---|
| Temperature range | RT (Ambient) +60 to +300°C |
| Maximum temperature | 300°C) |
| Temperature uniformity | ±1.5% |
| Power supply | 380V 3φ 50HZ 18kVA |
| Cool-down time | 100 min |
| Oxygen concentration | 100 ppm |
Translation and unit presentation are provided for navigation. The cited official source remains the audit reference.
Features, control & automation
Downloads
English datasheet
Coming soon — no PDF fabricated
Application guide
Coming soon — no PDF fabricated
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Engineering review