AO-2DSL-FCNET
Low-Oxygen Oven
- Chamber dimensions
- W1000 × D500 × H610 × 2 mm
- Temperature range
- RT (Ambient) +60 to +300°C
Semiconductor Process Ovens
AOL-216-PC
PI / BPO / BCB Curing Oven
PI / BPO / BCB Curing Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.
Key performance
Published values at a glance.
Values are shown only when they were extractable from this model's official DONE-E page.
- Chamber dimensions
- W600×H600×D600
- Exterior dimensions
- W950×H1510×D1340
- Temperature uniformity
- ±2% (empty chamber)
- Rated power
- AC380V 3φ 50Hz, 6kW
Product overview
Source-led, model-specific information.
PI / BPO / BCB Curing Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.
Data status
Verified specifications translated from the official product page
Source verification
Official DONE-E source URLs are retained in the internal product data for factual audit.
Applications
Exact English application wording is to be confirmed. This product is currently organized under Semiconductor Process Ovens; engineering review is required before matching it to a process.
Technical specifications
Published model data.
No value is borrowed from another product. Fields missing from the official page remain unpublished here.
| Chamber dimensions | W600×H600×D600 |
|---|---|
| Exterior dimensions | W950×H1510×D1340 |
| Temperature uniformity | ±2% (empty chamber) |
| Rated power | AC380V 3φ 50Hz, 6kW |
| Cleanliness | Class 100 |
| Oxygen concentration | ≤100 ppm after 40 min |
Translation and unit presentation are provided for navigation. The cited official source remains the audit reference.
Features, control & automation
Only capabilities detected on this product page.
- SUS304 stainless-steel construction or components, within the scope stated by the source
- Touchscreen interface
- Historical data query or recording
- USB data export is stated
- MES connectivity is stated for this product
- SECS/GEM connectivity is stated for this product
Downloads
Technical documents.
English datasheet
Coming soon — no PDF fabricated
Application guide
Coming soon — no PDF fabricated
Related products
More in Semiconductor Process Ovens.
AOL-100-PC
PI / BPO / BCB Curing Oven
- Temperature range
- Ambient+20°C to 500°C
- Cleanliness
- Class 100
AOL-100GV-HMI
Wafer Baking Oven
- Chamber dimensions
- W 61 0×H 65 0×D 75 0
- Exterior dimensions
- W1900 × H2075 × D1250
Engineering review