
AO-2DSL-FCNET
Low-Oxygen Oven
- Chamber dimensions
- W1000 × D500 × H610 × 2 mm
- Temperature range
- RT (Ambient) +60 to +300°C
Semiconductor Process Ovens
Clean Oven
Clean Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.

Key performance
Values are shown only when they were extractable from this model's official DONE-E page.
Product overview
Clean Oven documented on the official DONE-E product page. Performance and configuration vary by model; the values below are included only when present in that source.
Data status
Verified specifications translated from the official product page
Source verification
Official DONE-E source URLs are retained in the internal product data for factual audit.
2 official records were consolidated into this one English model page.
Applications
Technical specifications
No value is borrowed from another product. Fields missing from the official page remain unpublished here.
| Chamber dimensions | 870×H1350×D870 |
|---|---|
| Exterior dimensions | W2160×H2175×D1350 |
| Temperature range | Ambient+25 to 250°C, |
| Temperature fluctuation | ±0.5°C (empty chamber) |
| Temperature uniformity | ±1.5% (empty chamber) |
| Power supply | 380v , 50Hz, 20kW |
| Cleanliness | Class 100 |
Translation and unit presentation are provided for navigation. The cited official source remains the audit reference.
Features, control & automation
Downloads
English datasheet
Coming soon — no PDF fabricated
Application guide
Coming soon — no PDF fabricated
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Engineering review